Alloy K（UNS K94610）

Alloy K is a nickel-cobalt ferrous alloy known for its low thermal expansion properties and excellent compatibility with glass and ceramics. It is widely used in applications requiring a reliable seal between metal and glass, such as in electronic components and vacuum tubes. 

Physical Properties

AVAILABLE PRODUCTS AND SPECIFICATIONS

Features

Low Thermal Expansion:

• Alloy K has a low coefficient of thermal expansion (CTE), which allows it to expand and contract at a rate similar to that of glass and ceramics. This property is crucial for applications that involve glass-to-metal seals.

Good Mechanical Strength:

• Alloy K exhibits high tensile and yield strength, making it suitable for applications requiring durability and resistance to deformation under stress.

Excellent Machinability:

• Alloy K can be easily machined into various shapes and sizes, allowing for precise fabrication of components.

Good Weldability:

• The alloy can be welded using various techniques, including laser welding and resistance welding, which is important for creating hermetic seals in electronic devices.

Magnetic Properties

1. Alloy K is ferromagnetic, which is beneficial in applications requiring magnetic properties, such as in certain electronic devices.

Corrosion Resistance:

• While not as corrosion-resistant as some stainless steels, Alloy K has adequate resistance to certain corrosive environments, especially when properly treated or coated.

Compatibility with Glass:

1. • Alloy K is specifically designed to be compatible with glass, making it ideal for applications where metal needs to be sealed to glass.

Electronics:

• Glass-to-Metal Seals: Alloy K is widely used in the production of glass-to-metal seals for electronic components like vacuum tubes, semiconductors, and photomultiplier tubes.
• Lead Frames: Used in integrated circuits and other electronic devices, where it provides a reliable connection between the chip and external circuitry.

Applications:

Aerospace:

Medical Devices:

Optical Devices:

Telecommunications:

Automotive:

Research and Development: